03.08.17
The field of flexible electronics is very promising, and developing hybrid manufacturing capabilities that include printing and traditional silicon-based electronics is seen as a strong option going forward.
With that in mind, NextFlex, America’s Flexible Hybrid Electronics (FHE) Manufacturing Institute was formed in 2015 by the Department of Defense (DoD) and FlexTech Alliance to advance manufacturing of FHE in the US. As part of its mission, NextFlex is issuing project awards for promising applications. The second batch of four projects was just announced, with $8.6 million worth of contracts issued.
University of Massachusetts Amherst, University of Massachusetts Lowell, American Semiconductor, Inc., and Binghamton University were the key recipients of the awards.
“The focus of these projects is to advance the technology landscape,” Jason Mars
With that in mind, NextFlex, America’s Flexible Hybrid Electronics (FHE) Manufacturing Institute was formed in 2015 by the Department of Defense (DoD) and FlexTech Alliance to advance manufacturing of FHE in the US. As part of its mission, NextFlex is issuing project awards for promising applications. The second batch of four projects was just announced, with $8.6 million worth of contracts issued.
University of Massachusetts Amherst, University of Massachusetts Lowell, American Semiconductor, Inc., and Binghamton University were the key recipients of the awards.
“The focus of these projects is to advance the technology landscape,” Jason Mars
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Stay ahead of the fast growing field of flexible and printed electronics, an emerging industry that promises to revolutionize the methods in which electronic components and systems are manufactured. Flexible and printed electronics covers smart packaging and labels, sensors and wearables, solar cells, displays and lighting, batteries, medical devices, military equipment, and much more.
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