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    Online Exclusives

    LOPEC 2018 to Focus on Latest Technologies

    Sessions will focus on Biomedical Applications, Functional Materials, Internet of Things and more.

    Related CONTENT
    • LOPEC 2018 Review: New Markets are Opening for Printed and Flexible Electronics
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    • LOPEC 2018's Business Conference Reflects on Past, Future
    David Savastano, Editor03.13.18
    LOPEC 2018 opens today at Messe Munchen. Organized by the OE-A, today’s program features an array of end users, material and equipment suppliers, researchers and more, showcasing the latest developments in printed, flexible and hybrid electronics.
     
    Wolfgang Mildner, LOPEC general chair and founder/CEO of MSW, will open the Plenary Session, and will be followed by Dr. Heidi Fagerholm, head of advanced technologies, Merck KGaA, who will cover “350 Years of Innovation is Just the Beginning!”
     
    Prof. Dr. Karl Leo of the Technische Universität Dresden (IAPP)will analyze “Novel Flexible Organic Devices for ‘Soft-Electronics’ Applications.” Dr. Leo will be followed by Francesca Rosella, chief creative director and co-founder of CUTECIRCUIT, who will discuss “CuteCircuit’s Pioneering Work, Transforming Wearable Technology into Fashion - 15 Years of Groundbreaking Fashion Innovation.”
     
    On the Technical Conference segments, there will be eight topics, with sessions covering Biomedical Applications; Energy; 3D MID (Mechatronic Interconnect Devices); Functional Materials; Korea Session; Internet of Things ; Public Funded Projects; and Substrates and Encapsulation.
     
    The session on Biomedical Applications will be covered by three presenters: Dr. Juha Virtanen, principal engineer, Wearable Sensors, GE Healthcare; Dr. Thomas Velten, head of department, Fraunhofer Institute for Biomedical Engineering; and Dr. Giorgio Mutinati, scientist at AIT Austrian Institute of Technology.
     
    Three speakers will bring their insights to the session on Energy: OPVIUS GmbH CEO Dr. Ralph Pätzold; Damien Hau, industrial, research and development manager for Armor; and Dr. Graham Morse, head of PV physics, Merck Chemicals Ltd.
     
    The topic of 3D MID (Mechatronic Interconnect Devices) will be discussed by three speakers: Jörg Franke, professor, Friedrich-Alexander Universität Erlangen-Nürnberg; Dr. Martin Hedges, managing director, Neotech AMT GmbH; and Manuel Martin, product manager, Beta Layout GmbH.
     
    The Functional Materials session includes Peratech Holdco Ltd. product manager Dr. Themis Afentakis; cynora GmbH scientist Dr. Harald Flügge; and Condalign AS CTO Dr. Henrik Hemmen.
     
    The Korea Session features Taik-Min Lee, Dept. of Printed Electronics , Korean Institute of Machinery & Materials (KIMM); Kyung-Tae Kang, principal researcher, International Electrotechnical Commission ( IEC ); and Dr. An Jung Chung, director KoPEA/KoPEA Secretariat/IEC TC119 Korea Mirror Committee expert, Korea Printed Electronics Industry Association KoPEA.
     
    The Internet of Things session includes PragmatIC CEO Scott White; Prof. Atif Shamim, assistant professor, King Abdullah University of Science and Technology (KAUST); and Jari Keskinen, project manager, Tampere University of Technology.
     
    Three speakers will bring their insights to the Public Funded Projects session: Dr. Jerome Gavillet, Printed Electronic Program director, CEA-Liten; Dr. João Gomes, COO, CeNTI - Centre of Nanotechnology and Smart Materials; and Dr. Ton Offermans, senior R&D engineer, CSEM.
     
    Substrates and Encapsulation includes talks by Dr. Roland Steim, project manager, Sefar AG; Dr. Jia-Chong Ho, division director, Display Technology Center (DTC), Industrial Technology Research Institute (ITRI); and Paolo Vacca, R&D manager, SAES Getters s.p.a.
     
    On the Scientific Conference side, there will be two sessions on Materials, two sessions on Devices, and one each on Proceses and Circuit Design Simulation and Systems.
     
    Materials I: Materials for Organic Thin-Film Transistors will have talks by Prof. Dr. Yong-Young Noh of Dongguk University; Surya Singaraju, PhD student, Karlsruhe Institute of Technology; Dr. Chang Guo, research associate, National Research Council Canada; and Prof. Dr. Sung-Lim Ko of Konkuk University.
     
    Presenters for Devices I: Light Emitting Diodes include Prof. Dr. Klaus Meerholz of University of Cologne; Prof. Dr. Paul Blom, director, Max Planck Institute for Polymer Research; Dr. André Geßner, scientist, Fraunhofer IAP; and Eurecat researcher Dr. Nikola Perinka.
     
    Processes I. Printed and Flexible Light Emitting Diodes will be covered by Dr. Stefan Mogck, head of department R2R Organik-Technologie, Fraunhofer Institute for Organic Electronics, Electron Beam and Plasma Technology FEP; Prof. Dr. Pim Groen, program manager, Holst Centre; and Lukas Engel, doctoral student, INM - Leibniz-Institut für Neue Materialien gGmbH.
     
    Devices II: Sensors and Biosensors will feature Prof. Dr. Luisa Torsi from the University of Bari; Dr. Larraitz Añorga, head of Sensors Unit, CIDETEC; and Dr. Mark Chappell, senior research physical scientist, US Army Engineer Research & Development Center.
     
    Materials II: Functional Materials for Printed Electronics includes five presenters: Nanomatch GmbH CEO Dr. Tobias Neumann; Dr. Marco Fritsch, postdoctoral research fellow, Fraunhofer IKTS Institute; Dr. Xiangyang Liu, research council officer, National Research Council Canada; Dana Mitra, scientific researcher, Technische Universität Chemnitz; and Dr. Esra Kücükpinar, researcher, Fraunhofer IVV.
     
    Circuit Design Simulation and Systems will be covered by Prof. Arokia Nathan, chair of Photonic Systems and Displays, University of Cambridge; Dr. Ryan Griffin, electronics designer, National Research Council Canada; and Dr. Mohammad Mashayekhi, researcher for Eurecat Technology Centre.
     
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