The European printed electronics sector has now reached a crucial point in its short history where it needs to focus much more on speeding up the commercialisation of its research discoveries.   Only relatively few companies in the sector have successfully commercialized technologies. But in the short-to-medium term, it looks increasingly likely they will be joined by many others because of the relatively large number of products now being taken from the prototype through to the market launches stage, particularly using low-cost large area electronics (LAE) technologies.   “A new paradigm in large-area manufacturing is here with up to 100 times lower capex per front-end die than traditional lithographic bulk-silicon processing,” Davor Sutija, chief executive of Norway-based Thin Film Electronics ASA, a global leader in near field communication (NFC) with printed electronic smart packaging, told a recent LAE conference in Cambridge, England.   He was ref