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Overcoming Challenges for Smart Packaging

Cost, manufacturing remain key obstacles that are being solved throughout the flexible electronics supply chain.

Overcoming Challenges for Smart Packaging

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David Savastano, Editor10.24.18

Smart packaging is making significant gains in a number of sectors, including NFC, wine & spirits, pharmaceutical and medical applications, among others. However, to become more widespread, there are eras that need to be improved, including cost and production.

Roy Bjorlin, global commercial and strategic initiatives director, Electronics Materials, Sun Chemical, said that offering solutions and innovations in printed electronics to an OEM has a well-established path and well-connected supply chain, but brand owners require their own discussions.

“Offering these same solutions to consumer brand groups and their traditional manufacturing base offers special challenges,&rd

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