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    Breaking News

    Stora Enso Introduces Sustainable RFID Tag Technology

    ECO technology enables the RFID tags to be produced on a 100% fiber-based paper label.

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    11.13.18
    Stora Enso launched a new sustainable RFID tag technology called ECO by Stora Enso, designed for intelligent packaging functionalities in the supply chain, retail and e-commerce applications. The technology enables paper-based RFID tags, providing a plastic-free and recyclable solution for packaging authentication.

    Intelligent Packaging by Stora Enso develops and delivers RFID technology, which allows the packaged product to be automatically tracked, traced and tamper-proofed throughout the entire supply chain. 
     
    Stora Enso's ECO technology enables the RFID tags to be produced on a 100% fiber-based paper label, unlike traditional plastic tags, resulting in a lower carbon footprint for sustainability conscious B2B and B2C companies.

    "The launch of ECO creates a truly sustainable option for our customers and consumers, accelerating the use of smart technology in Stora Enso's renewable solutions," said Martin Ros, head of Stora Enso intelligent packaging. "Our ECO technology is unique in the sense that it offers a recyclable and plastic layer free option for RFID end-users, thus enabling a digital and sustainable packaging infrastructure."

    By integrating the RFID tag with a paper label, the manufacturing process becomes more scalable and, as result, also more cost-effective - all without compromising on performance and reliability. The ECO tag can be recycled in an environmentally friendly way together with paper and board materials. Moreover, it offers high conductivity at a lower cost compared with graphene or silver printed antennas. The ECO technology is available for use in multiple ongoing projects across multiple sectors.

    Intelligent Packaging by Stora Enso enables packaged products to be automatically tracked, traced and tamper-proofed throughout the entire supply chain using RFID technology. RFID is a wireless technology for the transfer of data that are electronically stored on tags attached to a package. The technology can identify several hundred items in sub-second speed and without line-of-sight interaction. Moreover, it allows communication between the brand-owner and the end-user by use of an NFC enabled smartphone. The solution provides complete reader systems and uses a cloud-based track-and-trace solution that runs on the Microsoft Azure platform. 
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    • Breaking News | RFID and NFC
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      First RFID rollout on the Dutch retail market.
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    • Breaking News | Semiconductors and Quantum Dots | Sensors and Wearables

      STMicroelectronics Releases Full-color Ambient Light Sensor for Smartphones

      The VD6281 is in production and available now from ST sales channels.
      02.20.19


    • Breaking News | Semiconductors and Quantum Dots

      American Semiconductor Launches Fully Flexible, Ultra Bluetooth IC

      The Semiconductor-on-Polymer chip scale packaged system on chip supports Bluetooth Low Energy (BLE) communication.
      02.20.19

    • 3D Printing | Breaking News
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      The imec chip was designed in standard 40nm CMOS and has a die size of 1.8mm2.
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    • Breaking News | RFID and NFC | Semiconductors and Quantum Dots | Sensors and Wearables
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      STMicroelectronics' NFC Universal Device Eases EMVCo 3.0 Compliance

      The ST25R3916 is in production now, available in a 5mm x 5mm 32-pin QFN package.
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      Smartrac will be in Hall 4 at booth B09, Feb. 19-21. LogiMAT takes place in Neue Messe, Stuttgart, Germany.
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      Graphene Pavilion Presents 20+ Prototypes at MWC 2019

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      Graphene Pavilion will be in NEXTech Hall 8.0 at Stand 8.0K31 on Feb. 25-28.
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      It is resistant to most chemicals and made from biocompatible glass.
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    Breaking News
    • TactoTek, Geely Design, CEVT Initiate Automotive Interiors Project in Printed, In-Mold Electronics
    • America Today Selects Nedap’s RFID Solution
    • STMicroelectronics Releases Full-color Ambient Light Sensor for Smartphones
    • American Semiconductor Launches Fully Flexible, Ultra Bluetooth IC
    • Massivit 3D Printed 1:1 Concept Car Signals the Future of Concept Prototyping
    View Breaking News >
    CURRENT ISSUE

    Fall 2018

    • Printed Electronics Now’s International Suppliers’ Directory
    • Brand Owners See Benefits of Smart Packaging
    • OLEDs, Quantum Dots Make Gains in the Display Market
    • New Opportunities for Flexible Sensors
    • Flexible Electronics Applied to the Development of Sensors
    • Conference Gives Glimpse into Future of Printed Electronics, Conductive Inks
    • View More >

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