"On behalf of everyone at American Semiconductor, we are pleased and honored to have been selected for the FLEXI Product Innovation Award for 2019. SoP wafer level chip scale packaging is producing the leading edge of reliable ultra-thin and flexible high-performance ICs. We are already working with some of the industry’s leading product innovators and we are looking forward to new engagements with everyone who needs a reliable ultra-thin chip solution", said Doug Hackler, President and CEO of American Semiconductor.
“So much is happening at ASI this month! We've won this FLEXI, are launching FleX-BLE chips right now and are adding FHE assembly to our suite of services," said Richard Ellinger, VP of sales and marketing. "Plus, we've announced our Joint Development Agreement with HD MicroSystems, a Joint Venture between Hitachi Chemical and DuPont, to install on-shore production capacity for SoP CSP and FHE assembly at our Boise site.”