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    Breaking News

    ASI Wins FLEXI Award for Best Product Innovation

    Recognition for new FleX-NFC flexible NFC technology.

    ASI Wins FLEXI Award for Best Product Innovation
    Related CONTENT
    • SEMI-FlexTech Announces 2019 FLEXI Awards Winners in Flexible Hybrid Electronics
    • SEMI-FlexTech Announces 2019 FLEXI Awards Winners in Flexible Hybrid Electronics
    • FLEX 2019 Looks at Applications, Reliability and More
    • American Semiconductor Launches Fully Flexible, Ultra Bluetooth IC
    • FLEX 2019 Looks at Applications, Reliability and More
    02.28.19
    American Semiconductor, Inc. was awarded the 2019 FLEXI award for Product Innovation by FlexTech for ASI's new FleX-NFC flexible NFC technology.

    "On behalf of everyone at American Semiconductor, we are pleased and honored to have been selected for the FLEXI Product Innovation Award for 2019. SoP wafer level chip scale packaging is producing the leading edge of reliable ultra-thin and flexible high-performance ICs. We are already working with some of the industry’s leading product innovators and we are looking forward to new engagements with everyone who needs a reliable ultra-thin chip solution", said Doug Hackler, President and CEO of American Semiconductor.

    “So much is happening at ASI this month! We've won this FLEXI, are launching FleX-BLE chips right now and are adding FHE assembly to our suite of services," said Richard Ellinger, VP of sales and marketing. "Plus, we've announced our Joint Development Agreement with HD MicroSystems, a Joint Venture between Hitachi Chemical and DuPont, to install on-shore production capacity for SoP CSP and FHE assembly at our Boise site.”
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    American Semiconductor Launches Fully Flexible, Ultra Bluetooth IC American Semiconductor Launches Fully Flexible, Ultra Bluetooth IC
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