This project focused on lowering the cost of future Internet of Things (IoT) devices through development of new conductive inks and flexible adhesives that improve the effectiveness, productivity and speed of printed electronics manufacturing.
The IoT market is estimated to be worth up to £10 trillion by 2025, presenting an enormous commercial opportunity for innovative companies. However, in many cases, these devices must be integrated with flexible electronics, and existing production lines use highly expensive materials. For the IoT market to reach its full potential, low-cost solutions are needed for the mass production of flexible electronics.
The Horizon 2020 Necomada project, which involved a consortium of 13 industry partners, has improved market accessibility by developing conductive inks and flexible adhesives that enable high-speed roll-to-roll manufacture of flexible electronics.
Partners in the consortium represented the entire value chain for printed electronics, from nanomaterial suppliers to end-users. The consortium has also established a pilot line at CPI that integrates the materials, printing and component placement capabilities that are essential for high-volume device manufacture.