IDTechEx11.17.20
Printed/flexible electronics is a constantly evolving area with extensive scope for innovation. Here, IDTechEx outlines three of the most exciting technological highlights in the sector.
These innovations span from technically advanced materials to novel manufacturing methodologies, covering a diverse set of applications that range from OLED displays to wearable healthcare patches.
Flexible Silicon
An especially exciting technical development is fully flexible thinned silicon integrated circuits (ICs). These support capabilities such as Bluetooth previously associated with packaged ICs to be mounted on flexible/curved substrates, enabling a wide range of novel form factors. The flexible ICs are produced by grinding down convention silicon die to as thin as 3 um before encapsulating it in polyimide and can have a bending radius as low as 1 mm.
Flexible mounted components are key components of the emerging manufacturing trend known as ‘Fle
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Stay ahead of the fast growing field of flexible and printed electronics, an emerging industry that promises to revolutionize the methods in which electronic components and systems are manufactured. Flexible and printed electronics covers smart packaging and labels, sensors and wearables, solar cells, displays and lighting, batteries, medical devices, military equipment, and much more.
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