Printed electronics applications include gas sensors, biosensors, humidity sensors, radiation sensors, antennas and more.
David Savastano, Editor10.02.19
As a member of the Manufacturing USA national institutes, NextFlex is the home for developing manufacturing capabilities for flexible hybrid electronics (FHE), from health care to sensors and much more. Formed in 2015 as a partnership between the US Department of Defense and FlexTech Alliance, NextFlex has an interest in governmental applications.
Recently, NextFlex held its fourth annual Innovation Day at its San Jose, CA headquarters, highlighting numerous projects. Among the projects that have significant potential is a gas sensor developed by the National Aeronautics and Space Administration, or NASA as it is far more commonly known. NASA Ames Research Center’s focus is on developing technologies for space exploration.
Dr. Meyya Meyyappan, chief scientist for exploration technology at NASA Ames Research Center, said that flexible hybrid electronics and 3D printing are areas of interest for the agency, which is partnering with NextFlex on biosensor applications.
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