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    Breaking News

    CPES2019 Announces First Group of Confirmed Speakers

    CPES2019 takes place May 16-17 at Domaine Chateau-Bromont in Bromont, Quebec.

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    03.19.19
    CPES2019, Canada’s conference and trade show exhibition for flexible and hybrid electronics (FHE), has announced its first cadre of confirmed speakers.
     
    Organized by the intelliFLEX Innovation Alliance, CPES2019 takes place May 16-17 at Domaine Chateau-Bromont in Bromont, Quebec.
     
    Here are the latest additions to the speaker lineup:
    • Alroy Almeida, CEO, Voltera – Almeida is CEO and co-founder of Voltera, a Canadian business working to bring rapid electronics fabrication to businesses and institutions around the world. Voltera focuses on early stages in the product development cycle as well as novel electronics applications. He will discuss the missing link in the printed electronics industry.
    • Ghada Badawy, professor, McMaster University – Badawy is a Principal Research Engineer at the Computing Infrastructure Research Center (CIRC). She leads projects in resource allocation, capacity optimization, load balancing, network as a large system, energy-related issues and cross-layer design in wireless networks, wireless mesh, vehicular and sensor networks. She will speak about the ways in which we can identify and embrace disruptive innovation.
    • Chloé Bois, R&D manager, Institut des communications graphiques et de l’imprimabilité (ICI) – Bois is R&D manager at ICI, where she specializes in advanced manufacturing, printed electronics applications, prototyping and developing methods to industrialize printed products manufactured by hybrid technologies such as graphic printing, printed electronics, and embedded standard electronics. Bois will speak about updates to flex roadmaps.
    • Justine Decaens, project leader, CTT Group  – Decaens works on R&D projects in technical textiles, smart textiles, advanced materials and protective clothing. She will speak about wearable tech and smart textiles as a platform for women’s leadership.
    • Ali Dehghantanha, director, Cyber Science Lab, University of Guelph  – Dehghantanha will speak about the use of machine learning to protect the industrial Internet of Things from cyberattacks.
    • Colin Singh Dhillon, CTO, APMA  – Dhillon is the CTO at Canada’s Automotive Parts Manufacturer’s Association (APMA). He oversees the Autonomous Vehicle Innovation Network (AVIN) Demonstration Zone and provides support to the Canadian automotive industry on matters of Advanced Vehicle and Industry Technology. He will speak about V2X opportunities.
    • Denis Faubert, president and CEO, CARIC/CRIAQ – Faubert is the president and CEO of both the Consortium for Aerospace Research and Innovation in Canada (CARIC) and the Consortium for Research and Innovation in Aerospace in Quebec (CRIAQ). Previously, he was the GM of the Hydro-Quebec Research Institute (IREQ). Faubert will speak about aerospace defense.
    • Mario LeClerc, Canada research chair, Universite Laval –LeClerc is the Canada research chair on Electroactive and Photoactive Polymers at Laval’s Centre de Recherche en Sciences et Ingénierie des Macromolécules (CERSIM). He is also head of NSERC’s GreEN Electronics Network. He will speak about the current state and future potential of green electronics.
    • James Lee, director of technology, Jones Packaging – Since 2013, Lee has held the position of director, technology and innovation at Jones Packaging, focusing on innovative packaging manufacturing and design technologies for tomorrow. He will speak about smart packaging and the availability of track and trace technologies.
    • William Wong, professor, University of Waterloo – Wong is a professor at the University of Waterloo in the Department of Electrical and Computer Engineering. His research focus is directed toward the development of thin film devices and novel nanocomposite materials for applications in high performance flexible electronics, solid state lighting, image sensors, and energy storage. He will speak about flexible electronics through heterogeneous integration of thin film and nanoscale materials.
     
    For more information about CPES2019, contact intelliFLEX CEO Mark Majewski at mmajewski@intelliflex.org. 
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