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    Live From Shows

    NextFlex Member Meetings at FLEX 2019

    Convening for a slate of member meetings at the annual FLEX Conference.

    Related Content
    • NextFlex, Profusa Unveil Skin-worn Reader Prototype for Continuous Oxygen Monitoring at FLEX 2019
    • New Applications, Technologies are Focus for 2019FLEX
    • 2019FLEX Examines New Opportunities for Flexible Hybrid Electronics
    • Kionix's Dr. John Chong Named Chair of MEMS & Sensors Industry Group Governing Council
    • Kionix's Dr. John Chong Named Chair of MEMS & Sensors Industry Group Governing Council
    02.19.19
    NextFlex members and government partners convene for a slate of member meetings at the annual FLEX Conference in Monterey, CA to advance US manufacturing of flexible hybrid electronics. There is no cost to attend NextFlex member meetings. NextFlex members also receive a member discount to attend the FLEX Conference; no code is required.
     
    Schedule:
    • Wednesday, Feb. 20
    12:00–1:30 p.m.: Technical Working Groups (TWG)
     
    All TWG members are invited to an update on the current status of the FHE Process Design Kit (PDK) and the Modeling & Design Roadmap. During short breakout sessions, ideas and prioritization of next steps for both the PDK and multi-physics modeling tools will be generated.
     
    Attendance is limited to government personnel and NextFlex members from Tiers 1, 2, and 3 only (multiple delegates welcome).
     
    • Thursday, Feb. 21
    12:00–4:00 p.m.: NextFlex Technical Council Meeting
    Attendance is limited to Technical Council Voting Members only.
     
    1:30–5:00 p.m.: NextFlex Technology Standards and Roadmapping Discussion, Technology Updates
     
    Chris Jorgenson of IPC will lead a strategic discussion of FHE Standards – their importance, their current status, and a path forward to addressing the gaps. NextFlex members AFRL, Kuprion, Averatek, and Sandia National Lab will discuss their unique FHE capabilities and will describe opportunities to collaborate. Government partners and all NextFlex members are welcome, including Observer-level members.
     
    4:00–6:00 p.m.: NextFlex Governing Council Meeting
    Governing Council members only.
     
    6:00–9:00 p.m.: Evening Member Event
    Network with fellow NextFlex members at Scales Seafood & Steaks on the wharf of Monterey Bay. Government partners and all NextFlex members are welcome, including Observer-level members.
     
    • Friday, Feb. 22
    8:00 a.m.–12:00 p.m.: NextFlex Project Update Technical Council Meeting
    Project updates and key outcomes of mechanical test and reliability projects, as well as other projects.
     
    • Lockheed Martin (Binghamton University) — Conformal printing of conductor and dielectric materials onto complex 3D surfaces
    • MicroConnex (University of Washington) — Bulk conductivity high-density interconnects
    • University of Massachusetts Lowell (DuPont, Raytheon, Jabil) — Test methods for electrical and mechanical durability of flexible/rigid interfaces in multi-axial fatigue and dynamic loadings
    • Binghamton University (DuPont, GE, Georgia Tech) — Assessment and optimization of the reliability of wearable performance monitors
    • Auburn University (Optomec) — Mechanical test methods for flexible hybrid electronics materials and devices
    • Georgia Tech (DuPont, Binghamton) — Development of test methods and standards to assess reliability of FHE components and systems
    Attendance is limited to government personnel and NextFlex members from Tiers 1, 2, and 3 only (multiple delegates welcome).
     
    • 2:00 p.m. and 3:00 p.m.: Tour NextFlex’s state-of-the-art Technology Hub with NextFlex technical staff in San Jose, CA 
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    • dupont
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    • Sensors and Wearables
      NextFlex, Profusa Unveil Skin-worn Reader Prototype for Continuous Oxygen Monitoring at FLEX 2019

      NextFlex, Profusa Unveil Skin-worn Reader Prototype for Continuous Oxygen Monitoring at FLEX 2019

      Reader that works with hydrogel sensor injected under the skin developed in only four months at NextFlex facility in San Jose.
      02.20.19

    • Flexible and Printed Electronics | Manufacturers News | Manufacturing | Printing | Research Institutions | Sensors and Wearables | Smart Cards and Packaging | Suppliers News | Universities

      New Applications, Technologies are Focus for 2019FLEX

      Sessions will cover Applications, Manufacturing, Sensors, Devices, Printing, Smart Transportation, Emerging Technologies and more.
      David Savastano, Editor 02.19.19

    • 2019FLEX Examines New Opportunities for Flexible Hybrid Electronics

      2019FLEX Examines New Opportunities for Flexible Hybrid Electronics

      Ford, John Deere, GE Global Research, UTRC and more will highlight applications for hybrid electronics.
      David Savastano, Editor 02.17.19


    • Kionix's Dr. John Chong Named Chair of MEMS & Sensors Industry Group Governing Council

      Dr. Chong is VP of product and business development at MEMS manufacturer Kionix.
      02.17.19

    • Breaking News | Flexible and Printed Electronics | Personnel | Semiconductors and Quantum Dots

      Kionix's Dr. John Chong Named Chair of MEMS & Sensors Industry Group Governing Council

      Dr. Chong is VP of product and business development at MEMS manufacturer Kionix.
      02.08.19

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