Direct die placement is seen as a viable alternative to the pick and place method.
David Savastano, Editor11.28.18
Flexible hybrid electronics are increasingly seen as an ideal means to bring together flexible, printed and traditional electronics. One key aspect is developing the manufacturing techniques that will merge these approaches together. Pick and place is a common means of production, but there are limitations.
systeMECH, Inc. believes it has an alternative production method. Developed by Dr. David Grierson and Prof. Kevin Turner at the University of Wisconsin-Madison, systeMECH was launched in 2011 to tap into the potential of its direct die placement process (DDP).
“Direct die placement (DDP) is a process by which thin semiconductor components, such as silicon dies, are transferred directly from a source carrier (e.g., a source wafer, dicing tape, or a die pack) to a destination substrate in a single step,” said Dr. Grierson, co-founder and CTO of systeMECH, Inc. “In contrast to conventional pick-and-place (PnP) tools that require a ‘pick’ step
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